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Time:
2023-05-12
High power LED packaging mainly involves aspects such as light, heat, electricity, structure, and technology. These factors are both independent and mutually influencing each other. Among them, light is the purpose of LED packaging, heat is the key, electricity, structure, and technology are the means, and performance is the specific manifestation of packaging level. From the perspective of process compatibility and reducing production costs, LED packaging design should be carried out simultaneously with chip design, that is, the packaging structure and process should be considered during chip design. Otherwise, after the completion of chip manufacturing, adjustments to the chip structure may be necessary due to packaging, which may extend the product development cycle and process costs, sometimes even impossible.